IDTechEx's video: Thinning a Silicon Chip Could Make it More Durable

@Thinning a Silicon Chip Could Make it More Durable

American Semiconductor (ASI) has installed the world's first ultra-thin wafer-level Chip Scale Packaging operation and assembly service in Boise, ID in 2019. ASI is the industry leader in flexible integrated circuits as well as a services provider for Flexible-Hybrid-Electronic (FHE) system design and prototype assembly. Standard and custom Semiconductor-on-Polymer (SoP) ICs are available ranging from OPAMPS to complex system-on-chip (SoC) to NFC and BLE. www.americansemi.com Filmed at IDTechEx Show! USA 2019 Learn more about our upcoming events: http://IDTechEx.com/Europe http://IDTechEx.com/USA

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This video was published on 2020-03-05 15:26:10 GMT by @IDTechEx on Youtube. IDTechEx has total 4.3K subscribers on Youtube and has a total of 603 video.This video has received 6 Likes which are lower than the average likes that IDTechEx gets . @IDTechEx receives an average views of 0.9K per video on Youtube.This video has received 0 comments which are lower than the average comments that IDTechEx gets . Overall the views for this video was lower than the average for the profile.

IDTechEx's video: Thinning a Silicon Chip Could Make it More Durable

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