SMT Process details sharing's video: Chip package components Tombstone

@Chip package components Tombstone

Generally small size components only we are facings tombstone issue due to many reasons. 1.improper land pad design 2.improper solder paste release 3.improper component placement and offset 4.solder surface tension 5.silkscreen Height variations 6.too high preheat time And so on

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This video was published on 2015-12-19 16:59:18 GMT by @SMT-Process-details-sharing on Youtube. SMT Process details sharing has total 1.1K subscribers on Youtube and has a total of 8 video.This video has received 22 Likes which are lower than the average likes that SMT Process details sharing gets . @SMT-Process-details-sharing receives an average views of 50K per video on Youtube.This video has received 2 comments which are lower than the average comments that SMT Process details sharing gets . Overall the views for this video was lower than the average for the profile.

SMT Process details sharing's video: Chip package components Tombstone

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