hotchipsvideos's video: HC31-K2: What Will the Next Node Offer Us

Keynote 2, Hot Chips 31 (2019), Tuesday, August 20, 2019 Dr. Philip Wong, VP Corporate Research, TSMC The power-performance-area (and cost) advances in the last five decades have mostly been achieved through dimensional scaling of the transistor. What will the semiconductor industry do after dimensional scaling of the silicon transistor crosses the nanometer threshold, from 16/12 nm, 10 nm, 7 nm, 5 nm, 3 nm, 2 nm, 1.4 nm to sizes below a nanometer? Will these advanced logic technologies continue to provide the energy efficiency required of future computing systems? Will new applications and computation workloads demand new device technologies and their integration into future systems? These are some of the most pressing questions facing the semiconductor industry today. The path for IC technology development going forward is no longer a straight line. The need for out-of-the-box solutions ushers in a golden age of innovation. I will give an overview of the memory and logic device innovations that are in the research pipeline today. Future electronic systems require co-innovation of the computing architecture and device technology. Dr. Wong speculates on how they will be integrated into future electronic systems.